Chapter 27 — SEMICONDUCTOR FABRICATION FACILITIES
Section 2705 — USE AND HANDLING
2025 California Fire Code (Title 24, Part 9) · 2025 edition · ingested 2026-07-07 · California
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2705.1 General. ¶
2705.1 General. The use and handling of hazardous materials shall comply with this section, Section 2703 and other applicable provisions of this code.
2705.2 Fabrication areas. ¶
2705.2 Fabrication areas. The use of hazardous materials in fabrication areas shall be in accordance with Sections 2705.2.1 through 2705.2.3.4. 2705.2.1 Location of HPM in use in fabrication areas. Hazardous production materials in use in fabrication areas shall be within approved or listed gas cabinets, exhausted enclosures or a workstation. on Jul 18, 2025 11:14 AM (CDT) THEREUNDER. SEMICONDUCTOR FABRICATION FACILITIES 2705.2.2 Maximum aggregate quantities in fabrication areas. The aggregate quantities of hazardous materials in a single fabrication area shall comply with Section 2704.2.2…
2705.3 Transportation and handling. ¶
2705.3 Transportation and handling. The transportation and handling of hazardous materials shall comply with Sections 2705.3.1 through 2705.3.4.1 and other applicable provisions of this code. 2705.3.1 Corridors and enclosures for stairways and ramps. Corridors and enclosures for exit stairways and ramps in new buildings or serving new fabrication areas shall not contain HPM, except as permitted in corridors by Section 415.11.7.4 of the California Building Code and Section 2705.3.2 of this code. 2705.3.2 Transport in corridors and enclosures for stairways and ramps. Transport in corridors and…